This is the old solder paste system which uses a syringe. It is not very consistent in the amount applied and the dots of paste are round while the pads are rectangular.
Solder paste syringe.
The new solder paste machine is more effective.
Solder paste mask - laser etched in a metal sheet - costs about 500SF
Wipers apply solder paste through the screen
Circuit board is supported under the screen
Components are described on the packaging.
The max time after opening and before mounting is given (72 hours in this case) as well as the baking requirements if this time is exceeded.
Baking oven is used to dry out components before soldering. Takes around 8 hours.
Oven for soldering components - 10 years old - uses heated vapour to transfer heat from a metal plate to the PCB
No infrared preheat is needed. The rate of heating is controlled by the rate of liquid injection onto the heated plate. This is the best way to mount components.
A board is instrumented with thermocouples to adjust the temperature profiles - the board is destroyed in the process.
After mounting, boards are washed. The machine recycles the cleaning product and rinses with demineralised water. Boards should be cleaned as soon as possible after mounting, ideally within 24 hours.
This power assisted press allows press fit connectors to be applied to the circuit board
Press fit connectors are prefered to soldered connectors
This is a 5-row press fit connector.
Finally boards are inspected
This microscope includes a variable zoom lens
BGA devices can be inspected sideways with this camera system
A dummy Xilinx BGA package is used to refine the mounting process - costs about 50SF instead of 2000SF for a real device.
New solder beads can be applied to a BGA package
Milling machine for making front panels
